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HD-H252-Z12 Ver: Gen001 | 2U High Density Server

  • 2U - 4 nodes rear access server system
  • AMD EPYC™ 7003 processors with AMD 3D V-Cache™ Technology
  • AMD EPYC™ 7003 series processor family
  • 4 x LGA 4094 sockets
  • 8-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
  • 8 x 1Gb/s LAN ports (Intel® I350-AM2)
  • 4 x Dedicated management ports
  • Aspeed® AST2500 remote management controller
  • 1600W (240V) 80 PLUS Platinum redundant PSU
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HD-H252-Z12 Ver: Gen001 | 2U High Density Serve

 

Nothing Stacks Up To EPYC™
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™

AMD EPYC 7003 Series Processors with AMD 3D V-Cache™ technology are raising the bar once more for breakthrough performance on targeted technical computing workloads like Electronic Design Automation, Computational Fluid Dynamics, and Finite Element Analysis software and solutions. Delivering breakthrough performance per core and performance per watt, the Zen 3 architecture maintains leadership in number of cores – up to 64, amount of L3 cache – 768MB, and 128 PCIe 4.0 lanes, while maintaining socket compatibility with existing 3rd Gen AMD EPYC platforms.

 

AMD EPYC™ 7003 Series Processors

HEXADATA servers and AMD EPYC 7003 Series Processors deliver the highest possible I/O throughput to pave the way for fast communication between CPU and accelerator in HPC and data analytics.

 

Max Memory Speed Even at 2 DPC

With HEXADATA unique solution, maximum memory speed is now supported, even when using 2 DIMMS per channel*. HEXADATA’s server platforms give you the performance edge, with more memory capacity at faster speeds.

 

Hardware Security

Hardware-level Root of Trust *

Protection is built in the silicon to ensure systems will not be vulnerable to security attacks or cyber threats. This hardware-level root of trust (ROT) helps isolate the system as the boot process starts to make sure a verified code is used.

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. HEXADATA TPM modules come in either a Serial Peripheral Interface (SPI) or low pin count (LPC) interface.

 

OCP 3.0 Ready

HEXADATA’s G-,H-,R- * series offer servers that feature an onboard OCP 3.0 slot for the next generation of PCIe 4.0 add on cards. Advantages of this new type include:

  • Easier Serviceability: simply slot in / pull out the card without needing to open the server chassis; tool less design
  • Larger Thermal Envelope: more space for heat sink provides an increased power budget for new & emerging capabilities

CMC for Chassis Management & Multi-Node Monitoring

HEXADATA’s H-Series Servers feature a Chassis Management Controller (CMC) for chassis-level management and node-level monitoring by connecting nodes internally via BMC chips integrated on each node. Resulting in only one mLAN connection required to perform monitoring of all four nodes*, and results in less Top-of-Rack (ToR) cabling and switch connections.

 

Multi-Server Management

HEXADATA’s H-Series Servers also feature the ability to create a “ring” connection for monitoring & management of all servers in a rack for greater cost savings and management efficiency.

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