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HD-H262-NO1 Ver: Gen001 | 2U High density Server

  •  2U - 4 nodes rear access server system
  •  3rd Gen. Intel® Xeon® Scalable Processors
  •  8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
  •  Supports Intel® Optane™ Persistent Memory 200 series
  •  Dual ROM Architecture supported
  •  Intel® C621A Express Chipset
  •  4 x Dedicated management ports
  •  2200W 80 PLUS Platinum redundant PSU
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HD-H262-NO1 Ver: Gen001 | 2U High density Server

Enhanced I/0:

Support for PCIe 4.0 allows for double the throughput of PCIe 3.0 for fast and large data transfers. Also, 64 lanes per socket with up to 128 lanes in a 2P configuration for fast data transmission from CPU to GPU, accelerator or storage.

CPU Performance Boost:

Now up to 40 cores per socket with greatly improved IPC on Intel’s 10nm architecture while operating CPUs at 105-270W. Also, an additional UPI lane is added for up to 11.2GT/s for a low latency interconnect between CPUs.

Next Gen Memory:

Each processor provides eight memory channels to support 8 or 16 DIMM slots with up to DDR4-3200. There are two sub-clustering modes, Sub NUMA (SNC) and Hemisphere (HEMI), available using balanced memory that results in performance improvements. Additionally, support for Intel Optane PMem 200 series provides two modes for greater memory capacity and data persistence to process large amounts of data faster.

Next Level Security:

New instructions and architecture deliver a high level of cryptographic operations for data privacy and protection. Cryptographic accelerators speed up encryption protocols as well as improvements in software guard extensions and memory encryption are added.

AI Acceleration:

AI inference and training are enhanced with DL Boost Technology for greater business, operational, and security insights. Applications include HPC, AI, and Media & Graphics.

Chassis Management Controller (CMC):

HEXADATA H-Series servers feature CMC* for chassis-level management and multi-node monitoring by connecting nodes internally via BMC integrated on each node to the CMC. This results in easier managment as there are less cables and network switch connections needed.

Ring Topology Management:

HEXADATA H-Series servers feature the ability to create a “ring” connection for monitoring & management of all servers in a rack for greater cost savings and management efficiency.

User Friendly:

OCP 3.0 Ready:

HEXADATA offers servers that feature an onboard OCP 3.0 slot for the next generation of add on cards. Advantages of this new type include:

  • Easy Serviceability: Simply slot in or pull out the card, without opening the server or using tools
  • Improved thermal design: Horizontal position and optimal heat sink design allow for air cooling to eliminate the heat efficiently

Optional TPM 2.0 Module:

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. HEXADATA TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

Dual ROM Architecture:

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

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